Program Committee
Program Committee
| Materials | Giuseppe Balestrino (University of Roma Tor Vergata, Italy) co-chair |
| David Cardwell (University of Cambridge, United Kingdom) | |
| Enrico Giannini (University of Geneva, Switzerland) | |
| Bernarhd Holzapfel (IFW, Dresden, Germany) | |
| Dirk Johrendt (University of Munich, Germany) | |
| Xavier Obradors (ICMAB, Barcelona, Spain) | |
| August Yurgens (Chalmers University, Sweden) | |
| Harald Weber (Technische Universitaet, Wien, Austria) | |
| Wires, Tapes and Conductors | Gianni Grasso (Columbus Superconductors, Italy) co-chair |
| Bernardo Bordini (Cern, Geneva, Switzerland) | |
| Giuseppe Celentano (ENEA, Frascati, Italy) | |
| Bartek Glowacki (University of Cambridge, United Kingdom) | |
| Wilfried Goldacker (KIT, Karlshrue, Germany) | |
| M'hamed Lakrimi (Siemens, Oxford, United Kingdom) | |
| Andrea Malagoli (CNR-SPIN, Genoa, Italy) | |
| Mark Rikel (Nexans Superconductors, Germany) | |
| Carmine Senatore (University of Geneve, Switzerland) | |
| Large scale applications | Pasquale Fabbricatore (INFN, Genova, Italy) co-chair |
| Kathleen Amm (GE Global Research Center, Niskayuna, USA) | |
| Pierluigi Bruzzone (CRPP-SC PSI Villigen, Switzerland) | |
| Fedor Gomory (IEEE Bratislava, Slovakia) | |
| Xavier Granados (ICMAB, Barcellona, Spain) | |
| Francois Kircher (CEA Saclay, France) | |
| Antonio Morandi (University of Bologna, Italy) | |
| Stefano Sgobba (CERN, Switzerland) | |
| Pascal Tixador (CNRS Grenoble, France) | |
| Ezio Todesco (CERN, Geneva, Switzerland) | |
| Vitaly S. Vysotsky (Russian Scientific R&D Cable Institute, Moskow, Russia) | |
| Electronics | Sergio Pagano (University of Salerno, Italy) co-chair |
| Kenji Enpuku (Kyushu University, Fukuoka, Japan) | |
| Pascal Febvre (University of Savoie, France) | |
| Flavio Gatti (University of Genoa, Italy) | |
| Valery Koshelets (IRE RAS, Moscow, Russia) | |
| Francesco Marsili (NIST, Boulder, USA) | |
| Hans Georg Meyer (IPHT, Jena, Germany) | |
| Oleg Mukhanov (HYPRES Inc, Elmsford, USA) | |
| Michael Siegel (KIT, Karlshrue, Germany) | |
| Dag Winkler (Chalmers University of Technology, Sweden) |
